Ceramic Substrates And Packages For Electronic Applications

Htcc high temperature co fired ceramics alumina system and ltcc low temperature co fired ceramics glass ceramic system are available.

Ceramic substrates and packages for electronic applications.

Rubalit 708 s with 96 al 2 o 3. Hermetic microelectronic packages also often referred to as hybrid packages multi chip module housings or ic packages are used to package and thereby protect sensitive electronic components and complete electrical assemblies from harsh environmental conditions including high temperature shock and vibration resistance. Kyocera ecu substrates provide high density circuit design high temperature durability good heat dissipation and high reliability with multilayer ceramics. The most economically important types of electronic ceramics include substrates integrated circuit ic packages and multichip modules capacitors ferrites insulators piezoelectrics and superconductors world electronics development 1998.

Substrates made from rubalit alumina ceramics. The insulating properties of ceramics are well known and these properties have found application in advanced ceramic materials for substrates and packages. This ceramic material is characterized by its extremely high strength and thermal conductivity. The materials and products are described in this article.

The outstanding surface quality on both sides makes it the perfect companion for any commercial thick film paste and even makes it suitable for a number of thin film applications sputtering. Over 150 us companies produce or supply electronic ceramics. At the same time the vacuum tight housings and substrates must.